Infineon Applied sciences AG introduced the growth of its Bluetooth portfolio by eight new merchandise within the AIROC CYW20829 Bluetooth Low Power 5.4 microcontroller (MCU) household, that includes Methods-on-Chip (SoCs) and modules optimized for industrial, client, and automotive use instances. The excessive integration of the CYW20829 product household permits designers to cut back bill-of-material (BOM) price and system footprint in all kinds of functions, together with PC equipment, low-energy audio, wearables, photo voltaic micro inverters, asset trackers, well being and life-style, house automation and others. Product designers additionally profit from Infineon’s wealthy improvement infrastructure and dedication to sturdy safety, with assist for safe boot and execution environments and cryptography acceleration to safeguard delicate information.
The newest automotive half within the product household, the AIROC CYW89829 Bluetooth Low-Power MCU, is right for automotive entry and wi-fi battery administration techniques (wBMS) functions, as a result of its sturdy RF efficiency, lengthy vary and newest Bluetooth 5.4 options together with PAwR (Periodic Promoting with Responses). The twin ARM Cortex core design of the chip household options separate utility and Bluetooth Low Power subsystems that ship full featured assist for Bluetooth5.4, low-power, 10 dBm output energy with no PA, built-in flash, CAN FD, crypto accelerators, excessive safety together with Root of Belief (RoT), and is PSA degree 1 prepared. “Infineon provides one of many business’s broadest portfolios of IoT options. Our Bluetooth options provide sturdy connectivity and the most recent options,” mentioned Shantanu Bhalerao, Vice President of the Bluetooth Product Line, Infineon Applied sciences. “Our automotive AIROC CYW89829 Bluetooth LE MCU, and versatile AIROC Bluetooth CYW20829 LE MCU ship ultra-low energy and a excessive diploma of integration for a greater consumer expertise throughout numerous functions in automotive, industrial, and client markets.”
Infineon has been working with prospects to design with present merchandise within the CYW20829 household and has obtained optimistic evaluations:
“The Infineon CYW20829 is the main Bluetooth half available in the market, which has handed the most recent Bluetooth 5.4 certification,” mentioned Kevin Wang, CEO of ITON. “CYW20829 has excellent RF efficiency, helps PAwR and LE Audio. These options carry extra prospects in client and industrial markets.”
“CYW20829, with excellent RF efficiency, versatile API, and good long-range options, offers a superb resolution for industrial lighting, industrial IoT, and extra,” mentioned Cai Yi, CEO of Pairlink.
“Earlier this 12 months, the Bluetooth SIG launched model 5.4 of the specification with new options: Periodic Promoting with Responses and Encrypted Promoting Knowledge. These options carried out on Infineon’s CYW20829 chips permit Addverb to develop a safe monitoring and controlling system for a fleet of wi-fi robots within the industrial warehouse, satisfying security necessities,” mentioned Tapan Pattnayak, Chief Scientist at Addverb, a worldwide chief in robotics.
Availability
The brand new merchandise can be found in a variety of variants, every with its particular characteristicsand focus functions.
Merchandise at present in manufacturing are:
CYW20829B0000, in a 56QFN SoC bundle, 6×6 mm, designed for PC equipment, remotes, ESL, and low-end BLE MCUs
CYW20829B0010, packaged in 56QFN SoC with a dimension of 6×6 mm, appropriate for gaming equipment and LE Audio merchandise
CYW20829B0-P4EPI100 and CYW20829B0-P4TAI100 modules, each with a dimension of 14.5×19 mm, appropriate for long-range, asset monitoring, energy instruments, and generic Bluetooth LE use instances
Sampling now are:
CYW20829B0021, in a 40QFN SoC bundle, 6×6 mm, suited to industrial and long-range functions
CYW89829B0022, in a 40QFN SoC bundle 6×6 mm, designed for wi-fi BMS and automotive entry
CYW89829B0232, in a 77BGA SoC bundle, 7×8 mm, appropriate for wi-fi BMS and automotive entry
Within the second quarter of 2025, samples are anticipated of the CYW20829B1230, which can be accessible in a 64 Ball BGA SoC bundle with a dimension of 4.5×4.5 mm and appropriate for wearables, energy instruments, and asset monitoring
Extra info associated to the AIROC CYW20829 Bluetooth LE MCU household may be discovered right here
Extra info associated to the AIROC CYW89829 Bluetooth LE MCU may be discovered right here.
