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Declares orders for 3Di ™ know-how on Dragonfly ® G3 system and launch of EchoScan ™ void detection system
Onto Innovation Inc. introduced advances in its product suite for 3D interconnect course of management, that includes the brand new 3Di™ know-how on the Dragonfly® G3 system for bump course of management in excessive bandwidth reminiscence (HBM) and superior logic purposes. Moreover, the EchoScan™ system is launched for detecting voids as small as 1µm in wafer bonding purposes, corresponding to superior hybrid bonding for Cu-Cu interconnects. Preliminary orders for the 3Di know-how embody a high HBM producer, a tier one OSAT and a number one producer of bump course of gear. The primary EchoScan system will ship within the first quarter, with further instruments deliberate to ship to prospects all through 2025.
Superior packages with 2.5D and 3D integration schemes are projected to develop at a price of 19% from 2024 by means of 2028, based on TechInsights. Interconnect bump heights in excessive quantity manufacturing (HVM) are lowering from 12µm to 8µm, and doubtlessly to 4µm. As bump sizes lower, metrology and inspection develop into more and more important to making sure excessive yields.
“Excessive-performance HBM and GPU units powering AI packages demand smaller line/house and bump pitch necessities,” says Mike Rosa, Onto’s chief advertising officer and senior vice chairman of technique. “Onto designed the 3Di know-how to fulfill prospects’ wants for extra steady applied sciences accommodating smaller bump sizes—even beneath 5µm in HVM and 2µm in R&D—in subsequent era logic and reminiscence units.”
Interconnect density intensifies with the adoption of hybrid bonding for bond pad interconnects, with planar bump heights and the problem of inline micro void detection on the Cu-Cu bond pad interface. Undetected voids can result in wafer cracking and open electrical connections, leading to yield loss. Present applied sciences are restricted to ≥10µm void measurement sensitivity and require water immersion, which provides the danger of bonded wafer contamination, delamination and lack of void traceability for inline course of management.
“Onto’s EchoScan system affords die and wafer degree, immersion free, non-contact know-how for voids all the way down to 1µm in HVM. This resolution is being launched to pick out prospects to detect 1µm voids in environment on the identical velocity as incumbent applied sciences restricted to ~10µm,” Rosa continued. “Whether or not utilizing micro bump or hybrid bonding applied sciences, Onto Innovation supplies the important course of management resolution. When paired with our Uncover® analytical software program, each options allow real-time defect evaluation and suggestions to course of instruments for statistical course of management, lowering the cycle time of yield loss evaluation and serving to prospects obtain excessive quantity manufacturing targets.”
To be taught extra in regards to the 3Di know-how on the Dragonfly G3 system and the EchoScan void detection system, contact us or attain out to your native gross sales crew.
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